TH-46
One Component (Heat To Cure)
Grey-back paste
Grey-back paste
產品說明
- ℃/minCuring Data:
150°C/45min
- (W/mk):
2.0
- Characteristics/Applications:
Grey-back paste, high Tg (198°C). For thermal conductive bonding / fixing.
High temp. resistance.
- ℃/minCuring Data:
150°C/45min - (W/mk):
2.0 - Characteristics/Applications:
Grey-back paste, high Tg (198°C). For thermal conductive bonding / fixing. High temp. resistance.
