TH-26
One Component (Heat To Cure)
White paste
White paste
產品說明
- ℃/minCuring Data:
150°C/60min
- (W/mk):
1.4
- Characteristics/Applications:
White paste, high thermal conductive and surface volume resistivity,
excellent bonding strength.
- ℃/minCuring Data:
150°C/60min - (W/mk):
1.4 - Characteristics/Applications:
White paste, high thermal conductive and surface volume resistivity, excellent bonding strength.
