TH-49
One Component (Heat To Cure)
Geay-black paste
Geay-black paste
產品說明
- ℃/minCuring Data:
150°C/60min
- (W/mk):
2.4
- Characteristics/Applications:
Geay-black paste, non-sag, soft-tongh non-shrink. For high thermal c
onductive bonding, filling and fixing.
- ℃/minCuring Data:
150°C/60min - (W/mk):
2.4 - Characteristics/Applications:
Geay-black paste, non-sag, soft-tongh non-shrink. For high thermal c onductive bonding, filling and fixing.
