2154
Optoelectronics Adhesive/Sealant
One-component
One-component
產品說明
- Viscosity(cps/25℃):
2000
- Curing Function UV, H, RT, C, ANA, SV:
150°C/1hr/li>
- Characteristics / Applications:
One-component, high Tg164°C, good fluidity, fast curing speed, shear strength 230kg/cm , surface volume resistivity 1.5×1017Ω. Bonding/Sealing for board level assembly of COB encapsulants / underfills.
- Viscosity(cps/25℃):
2000 - Curing Function UV, H, RT, C, ANA, SV:
150°C/1hr/li> - Characteristics / Applications:
One-component, high Tg164°C, good fluidity, fast curing speed, shear strength 230kg/cm , surface volume resistivity 1.5×1017Ω. Bonding/Sealing for board level assembly of COB encapsulants / underfills.
