731
For Electronics Industry
Acetoxy cure
Acetoxy cure
產品說明
- Characteristics:
Acetoxy cure. Cure without shrinkage. Non-sag. Weatherproof. Excellent electrical characteristics and resistance to high temperature.
- Applications:
For strong bonding of materials in electronics industry or sealing/bonding of glass, siliceous materials.
- Characteristics:
Acetoxy cure. Cure without shrinkage. Non-sag. Weatherproof. Excellent electrical characteristics and resistance to high temperature. - Applications:
For strong bonding of materials in electronics industry or sealing/bonding of glass, siliceous materials.