Product Line

Hi-Tech Requirement
106

106

Hi-Tech Requirement
Gel/slow-cure type

產品說明
  • Viscosity(cps/25℃):
    non-sag
  • Characteristics:
    Gel/slow-cure type. Non-sag. Allows gap filling capability up to 0.2". Bond strength up to 4200psi.
  • Applications:
    For gap filling, bonding of porous materials or applying on overhead surfaces and vertical surfaces.
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